:::

 
 
 
 
:::
現在位置首頁 > 師資介紹 > 專兼任師資
  • 回上一頁

基本資料

鄭仙志 老師
鄭仙志 老師的基本資料
教師姓名
鄭仙志
職稱
特聘教授
e-mail
hcchengatfcu.edu.tw
分機號碼
#3979

專長

專長
專長
1 結構最佳化設計Optimal Structural Design
2 電子構裝力學分析及設計Thermal-mechanical Analysis and Design of Electronic Packaging
3 有限元素法/分析Finite Element Methods and Analysis
4 固體力學與結構動力學Solid Mechanics and Structural Dynamics
5 分子模擬及微奈米結構力學Molecular Dynamics and Nano-Micro Mechanics
6 網路分散式計算Web-based Distributed Computing

學歷

學歷
畢業學校
主修學門系所
學位
時間(起)
時間(迄)
1 密西根大學安娜堡分校 機械暨應用力學研究所 博士 1989-09 1994-05
2 國立成功大學 土木工程學系 學士

校內經歷

校內經歷
服務系所
職稱
時間(起)
時間(迄)
1 航太與系統工程學系 教授 2005-08 2013-01
2 航空工程學系 副教授 2001-03 2005-07
3 航太與系統工程學系 系主任 2019-08 2021-07
4 校務企劃組 副研究員 2001-03 2001-07
5 航太與系統工程學系 特聘教授 2019-08 2022-07

發表期刊論文

發表期刊論文
1 H.-C. Cheng*, C.-H. Chung, and W.-H. Chen, "Die Shift Assessment of Reconstituted Wafer for Fan-out Wafer-Level Packaging," IEEE Transactions on Device and Material Reliability, vol. 20, no. 1, pp. 136-145, 2020-03. (SCI)
2 H.-C. Cheng*, C.-H. Wu, and S.-Y. Lin, "Thermal and Electrical Characterization of Power MOSFET Module Using Coupled Field Analysis," Journal of Mechanics, vol. 35, no. 5, pp. 641-655, 2019-10. (SCI)
3 H.-C. Cheng* and Y.-C. Liu, "Warpage Characterization of Molded Wafer for Fan-out Wafer-level Packaging," Journal of Electronic Packaging, ASME Transactions, Published online September 19, 2019, DOI: https://doi.org/10.1115/1.4044625, 2019-09. (SCI)
4 H.-C. Cheng*, R.-Y. Hong and W.-H. Chen*, "Assessment of Elastic-plastic and Electrical Properties of Printed Silver-based Interconnects for Flexible Electronics," Journal of Electronic Packaging, ASME Transactions, vol. 140, no. 4, pp. 041007(10 pages), 2018-12. (SCI)
5 W.-H. Chen, C.-F. Yu*, and H.-C. Cheng*, "Theoretical Assessment of Structural, Mechanical and Thermodynamic Properties of Pd2Al," Solid State Sciences, vol. 68, pp.10-18, 2017-06. (SCI)
6 W.H. Chen, H. C. Cheng*, and C. F. Yu, "First-Principles Calculation of Interfacial Adhesion Strength and Electromigration for the Micro-bump Interconnect of 3D Chip Stacking Packaging," CMES-Computer Modeling in Engineering & Science, Vol. 109, No. 1, pp. 1-13, 2015-11. (SCI)
7 C.-F. Yu, H.-C. Cheng* and W.-H. Chen*,, "Structural, mechanical, thermodynamic and electronic properties of AgIn2 and Ag3In intermetallic compounds: Ab initio investigation," RSC Advances, 5/86, 2015-08. (SCI)
8 W.-H. Chen, C.-F. Yu, K.-N. Chiang, H.-C. Cheng*, "First-principles Density Functional Calculations of Physical Properties of Orthorhombic Au2Al Crystal," Intermetallics, 62, 2015-07. (SCI)
9 H.-C. Cheng*, H.-H. Huang, W.-H. Chen* and S.-T. Lu, "Hygro-Thermo-Mechanical Behavior of Adhesive-based Flexible Chip-on-Flex Packaging," Journal of Electronic Materials, 44/04, 2015-04. (SCI)
10 C.-C. Lee*, C.-H. Liu, H.-C. Cheng, R. H. Deng, "Structural Optimizations of Silicon Based NMOSFETs with a Sunken STI Pattern by Using a Robust Stress Simulation Methodology," Journal of Nanoscience and Nanotechnology, 15/03, 2015-03. (SCI)
11 H.-C. Cheng*, W.-H. Xu, W.-H. Chen*, P.-H. Wang, K.-F. Chen, and C.-C. Chang, "Bending Characteristics of Foldable Touch Display Panel with a Protection Structure Design," Advances in Materials Science and Engineering, 2015, 2015-03. (SCI)
12 C.-F. Yu, H.-C. Cheng* and W.-H. Chen*, "Structural, Mechanical and Thermodynamic Properties of AuIn2 Crystal under Pressure: A First-Principles Density Functional Theory Calculation," Journal of Alloys and Compounds, 619, 2015-01. (SCI)
13 K. M. Chen*, C. Y. Wu, C. H. Wang, H.-C. Cheng*, N. C. Huang, "An RDL UBM Structural Design for Solving Ultralow-K Delamination Problem of Cu Pillar Bump Flip Chip BGA Packaging," Journal of Electronic Materials, 43/11, 2014-11. (SCI)
14 M.-K. Yeh*, L.-Y. Chang, M.-R. Lu, H.-C. Cheng and P.-H. Wang, "Bending stress analysis of flexible touch panel," Microsystem Technologies, 20/8, 2014-08. (SCI)
15 H.-C. Cheng*, C.-F. Yu, and W.-H. Chen*, "Size, Temperature and Strain-rate Dependence on Tensile Mechanical Behaviors of Ni3Sn4 Intermetallic Compound using Molecular Dynamics Simulation," Journal of Nanomaterials, 2014/, 2014-08. (SCI)
16 W. H. Chen*, C. F. Yu and H. C. Cheng*, "On the First-principles Density Functional Theory Calculation of Electromigration Resistance Ability for Sn-based Intermetallic Compounds," CMES-Computer Modeling in Engineering & Sciences, 100/02, 2014-07. (SCI)
17 C.-C. Lee*, H.-C. Cheng, H.-W. Hsu, Z.-H. Chen, H.-H. Teng, and C. H. Liu,, "Mechanical property effects of Si1−xGex channel and stressed contact etching stop layer on nano-scaled n-type metal–oxide–semiconductor field effect transistors," Thin Solid Films, 557/, 2014-04. (SCI)
18 H.-C. Cheng*, H.-K. Cheng, S.-T. Lu, and W.-H. Chen*, "Drop Impact Reliability Analysis of 3-D Chip-on-Chip Packaging: Numerical Modeling and Experimental Validation," IEEE Transactions on Device and Materials Reliability, 14/1, 2014-03. (SCI)
19 H.-C. Cheng*, C.-F. Yu, and W.-H. Chen*, "Physical, Mechanical, Thermodynamic and Electronic Characterization of Cu11In9 Crystal Using First-principles Density Functional Theory Calculation," Computational Materials Science, 81/, 2014-01. (SCI)
20 H.-C. Cheng*, Y.-M. Tsai, S.-T. Lu, J.-Y. Juang and W.-H. Chen*, "Interconnect Reliability Characterization of a High-density 3-D Chip-on-Chip Interconnect Technology," IEEE Transactions on Components, Packaging and Manufacturing, 12/3, pp.2037-2047, 2013-12. (SCI)
21 H.-C. Cheng*, C.-H. Ma1, C.-F. Yu, S.-T. Lu and W.-H. Chen, "Process-dependent Thermal-Mechanical Behaviors of an Advanced Thin-Flip-Chip-on-Flex Interconnect Technology with Anisotropic Conductive Adhesive Joints," Computers, Materials & Continua, 03/38 pp.129-154, 2013-12. (SCI)
22 H.-C. Cheng*, C.-F. Yu, K.-L. Chen and W.-H. Chen*, "Thermal-Mechanical and Thermodynamic Properties of Graphene Sheets using a Modified Nosé-Hoover Thermostat," Computers, Materials & Continua, 2/36, pp.203-229, 2013-09. (SCI)
23 H.-C. Cheng*, W.-R. Ciou, W.-H. Chen*, J.-L. Kuo, H.-C. Lu and R.-B. Wu, "Heat Dissipation Analysis and Design of a Board-Level Phased-Array Transmitter Module for 60-GHz Communication," Applied Thermal Engineering, 1/53, pp.78-88, 2013-04. (SCI)
24 H.-C. Cheng*, C.-F. Yu, and W.-H. Chen*, "First-principles Density Functional Calculation of Mechanical, Thermodynamic and Electronic Properties of CuIn and Cu2In Crystals," Journal of Alloy and Compounds, 5/546, pp.286-295, 2013-01. (SCI)
25 W.-H. Chen*, C.-F. Yu, H.-C. Cheng*, Y.-M. Tsai, and S.-T. Lu, "IMC Growth Reaction and Its Effects on Solder Joint Thermal Cycling Reliability of 3D Chip Stacking Packaging," Microelectronics Reliability, 1/53, pp.30–40, 2013-01. (SCI)
26 H. C. Cheng, C.-H. Wu and W.-H. Chen*, "Low-Temperature Thermal Conductivity of Short Single-Walled Carbon Nanotubes Using a Modified Nos?-Hoover Thermostat," Nanoscale and Microscale Thermophysical Engineering, 16/4, pp.242-259, 2012-12. (SCI)
27 W.-H. Chen, C.-F. Yu, H. C. Cheng*, S.-T. Lu,, "Crystal Size and Direction Dependence of the Elastic Properties of Cu3Sn through Molecular Dynamics Simulation and Nanoindentation Testing," Microelectronics Reliability, 52/8, pp.1699-1710, 2012-08. (SCI)
28 S.-T. Lu, J.-Y. Juang, H.C. Cheng, Y.-M. Tsai, T.-H. Chen, W.-H. Chen, "Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro Bump Chip-to-Chip (C2C) Interconnection for 3D Chip Stacking," IEEE Transactions on Device and Materials Reliability, 12/2, pp.296-305, 2012-06. (SCI)
29 H.C. Cheng, J.Y. Lin, and W.H. Chen, "On the Thermal Characterization of an RGB LED-based White Light Module," Applied Thermal Engineering, 38/2, pp.105-116, 2012-05. (SCI)
30 H.C. Cheng, I-C Chung, and W-H Chen, "Thermal Chip Placement in MCMs Using a Novel Hybrid Optimization Algorithm," IEEE Transactions on Components, Packaging and Manufacturin, 2/5, pp.764-774, 2012-05. (SCI)
31 H.C. Cheng, C.-F. Yu and W.-H. Chen, "Strain- and Strain-Rate-dependent Mechanical Properties and Behaviors of Cu3Sn Compound using Molecular Dynamics Simulation," Journal of Materials Science, 47/7, pp 3103-3114, 2012-04. (SCI)
32 W.-H. Chen, C.-H. Wu, and H.C. Cheng, "Temperature-dependent Thermodynamic Behaviors of Carbon Fullerene Molecules at Atmospheric Pressure," Journal of Computers, Materials, & Continua, 25/03, PP. 195~214, 2011-12. (SCI)
33 H.C. Cheng, Y.-L. Liu, C.-H. Wu, W.H. Chen,, "Molecular Dynamics Study of Interfacial Bonding Strength of Self-Assembled Monolayer-Coated Au-Epoxy and Au-Au Systems," Applied Surface Science, 257/20, PP. 8665~8674, 2011-08. (SCI)
34 W.H. Chen,C.H. Wu and H.C. Cheng, "Modified Nose-Hoover Thermostat for Solid State for Constant Temperature Molecular Dynamics Simulation," Journal of Computational Physics, 230/16, PP. 6354~6366, 2011-07. (SCI)
35 H.C. Cheng, K.-Y. Hsieh and K.-M. Chen, "Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology," Microelectronics Reliability, 51/4, PP. 826~836, 2011-04. (SCI)
36 H.C. Cheng, Yang-Howa Tsai, Kun-Nan Chen, Jiunn Fang,, "Thermal Placement Optimization of Multichip Modules Using a Sequential Metamodeling-based Optimization Approach," Applied Thermal Engineering, 30/17-18, PP. 2632~2642, 2010-12. (SCI)
37 H.C. Cheng, Y.L. Liu, C.-H.Wu and W.H. Chen,, "On radial breathing vibration of carbon nanotubes," Computer Methods in Applied Mechanics and Engineering, 199/45-48, PP. 2820~2827, 2010-11. (SCI)
38 L.-C. Shen, C.-W. Chien, H.C. Cheng and C.-T. Lin, "Development of Three-dimensional Chip Stacking Technology Using a Clamped Through Silicon Via Interconnection," Microelectronics Reliability, 50/4, PP. 489~497, 2010-04. (SCI)
39 W.H. Chen, H.C. Cheng, and Y.L. Liu, "Radial Mechanical Properties of Single-Walled Carbon Nanotubes Using Modified Molecular Structure Mechanics," Computational Materials Science, 47/4, PP. 985~993, 2010-02. (SCI)
40 H.C. Cheng, W.Y. Hwang, K. S. Kao, J. Tsang, S. S. Yang, C. C. An, and S. M. Chang, "Thermal-mechanical Process Simulation of an Advanced NCF Technology," IEEE Transactions on Electronics Packaging Manufacturing,, 32/4, PP. 301~310, 2009-10. (SCI)
41 H.C. Cheng, I-C Chung and W.H. Chen, "Response Surface based Thermal Optimization Approach for Chip Placement Design of Multiple-Chip Modules," IEEE Transactions on Components and Packaging Technologies, 32/3, PP. 531~541, 2009-09. (SCI)
42 H.C. Cheng, Y.-C. Hsu, W.-H. Chen, "The Influence of Structural Defect on Mechanical Properties and Fracture Behaviors of Carbon Nanotubes," Journal of Computers, Materials, & Continua, 11/2, PP. 127~146, 2009-06. (SCI)
43 Fen, C.-S., C. Chan, and H.-C. Cheng, "Assessing a response surface-based optimization approach for soil vapor extraction system design," Journal of Water Resources Planning and Management, 135/3, PP. 198~207, 2009-05. (SCI)
44 Hsien-Chie Cheng, Wen-Hwa Chen, Chieh-Sheng Lin, Yung-Yu Hsu, and Ruoh-Huey Uang, "On the Thermal-mechanical Behaviors of a Novel Nanowire-based Anisotropic Conductive Film Technology," IEEE Transactions on Advanced Packaging, 32/02, PP. 546~563, 2009-05. (SCI)
45 H.C. Cheng, Y.L. Liu, and W.H. Chen, "Atomistic-Continuum Modeling for Mechanical Properties of Single-Walled Carbon Nanotubes," International Journal of Solids and Structures, 46/7-8, PP. 1695~1704, 2009-04. (SCI)
46 CHIU-SHIA FEN, HSIEN-CHIE CHENG and CHEN-CHI KU, "An effective response surface-based optimization approach for soil vapor extraction system design," Civil Engineering and Environmental Systems, 25/03, PP. 227~243, 2008-09. (SCI)
47 W.H. Chen, H.C. Cheng, Y.-C. Hsu, R.-H. Uang, J.S. Hsu, "Mechanical Material Characterization of Co Nanowires and Their Nanocomposite," Composite Science and Technology, 68/15-16, PP. 3388~3395, 2008-08. (SCI)
48 H.C. Cheng, W.H. Chen and H.F. Cheng, "Theoretical and Experimental Characterization of Heat Dissipation in a Board-Level Microelectronic Component,," Applied Thermal Science, 28/5-6, PP. 575~588, 2008-04. (SCI)
49 W.H. Chen, H.C. Cheng, and Y. L. Liu, "Effects of Surface and In-layer van der Waals Interaction on Mechanical Properties for Carbon Nanotubes," Advanced Materials Research, 33-37, PP. 993~998, 2008-03. (EI)
50 W.H. Chen, H.C. Cheng and Y.C. Hsu, "Mechanical Properties of Carbon Nanotubes Using Molecular Dynamics Simulations with the Inlayer van der Waals Interactions," Computer Modeling in Engineering and Science, 20/2, PP. 123~145, 2007-08. (SCI)
51 H.C. Cheng, Y.C. Huang, W.H. Chen, "A Force-Directed Based Optimization Scheme for Thermal Placement Design of MCMs," IEEE Transactions on Advanced Packaging, 30/1, PP. 56~67, 2007-02. (SCI)
52 H.C. Cheng, C.L. Ho, W.C. Chen and S.S. Yang, "A Study of Process-induced Deformations of Anisotropic Conductive Film (ACF) Assembly," IEEE Transactions, Component Packaging and Technologies, 29/03, PP. 577~588, 2006-09. (SCI)
53 J.C. Lin, H.C. Cheng, K.N. Chiang, "Design and Analysis of Wafer-Level CSP with Double-Pad-Structure," IEEE Transactions on Components and Packaging Technologies, 28/01, PP. 117~126, 2005-03. (SCI)
54 HC. Cheng & C.S. Fen, "A Web-based Distributed Problem-Solving Environment for Engineering Applications," Advanced Sofware in Engineering, 37, PP. 112~128, 2005-02. (SCI)
55 H. C. Cheng, C. Y. Yu and W. H. Chen, "An Effective Thermal-mechanical Modeling Methodology for Large-scale Area Array Typed Packages," Computer Modeling in Engineering and Sciences, 7/01, PP. 1~17, 2005-01. (SCI)
56 C.T. Peng, C.M. Liu, J.C. Lin, H.C. Cheng, K.N. Chiang, "Reliability Analysis and Design for the Fine-pitch Flip Chip BGA Packaging," IEEE Transactions on Components and Packaging Technologies, 27/4, PP. 684~693, 2004-12. (SCI)
57 W.H. Chen, H.C. Cheng, C.H. Lin, "On the Thermal Performance Characteristics of 3-D Multichip Modules," ASME Transactions, Journal of Electronic Packaging, Vol. 126, PP. 374~383, 2004-09. (SCI)
58 H.C. Cheng, W.H.Chen and I-C Chung, "Integration of Simulation and Response Surface Methods for Thermal Design of Multichip Modules," IEEE Transactions on Components, Packaging and Technology, Vol 2/No. 2, PP. 359~372, 2004-06. (SCI)
59 H.C. Cheng, C.L. Ho, K.N Chiang and S.M. Chang, "Process-dependent Contact Characteristics of NCA Assemblies," IEEE Transactions on Components, Packaging and Technology, Vol. 27/ No. 2, PP. 398~410, 2004-06. (SCI)
60 W.H.Chen, H.C. Cheng and H.A. Shen, "An Effective Methodology for Thermal Characterization of Electronic Packaging," IEEE Transactions on Components, Packaging and Technology, Vol 26, No. 1, PP. 222~232, 2003-03. (SCI)
61 H.C. Cheng, K.N. Chiang, and T.Y. Chen, "Topology Optimization of Elastic Structures for Stability," Journal of Chinese Society of Mechanical Engineers, Vol. 22/No. 5, PP. 391~398, 2001-08. (EI)
62 H.C. Cheng, K.N. Chiang, C. K. Chen, and J.C. Lin,, "Solder Joint Reliability of Thermal Enhanced BGA Using a Finite-Volume-Weighted Averaging Technique," Journal of the Chinese Institute of Engineers, Vol. 24/No. 4, PP. 439~451, 2001-08.
63 H.-C. Cheng, K.-N. Chiang, C.-K. Chen, and J.-C. Lin, "A Study of Factors Affecting Solder Joint Fatigue Life of Thermally Enhanced Ball Grid Array Assemblies," Transactions of the Chinese Institute of Engineers, Seires A, Vol. 24/ No. 4, PP. 439~451, 2000-08. (SCI)

會議論文

會議論文
1 Hsuan-Chi Hu, Hsien-Chie Cheng, Tzu-Chin Huang, Wen-Hwa Chen, Shen-Tsai Wu, and Wei-Chung Lo, "On the Thermal Performance Analysis of Three-dimensional Chip Stacking Electronic Packaging with Through Silicon Vias," ICEP-IAAC 2015 , 2015-04. Kyoto, Japan.
2 鄭仙志*、王聖夫、連韋翔, "高功率白光LED光學分析與二次光學透鏡設計," 第九屆海峽兩岸航空太空學術研討會會議議程 , 2014-11. 淡江大學.
3 Ching-Feng Yu, Hsien-Chie Cheng* and Wen-Hwa Chen*, "Structural, Mechanical and Thermodynamic Properties of AuIn2 Crystal under Pressure: A First-Principles Density Functional Theory Calculation," IMPACT2014 , 2014-10. 台北南港世貿.
4 Hsien-Chie Cheng, Wei-Heng Xu, Wen-Hwa Chen and Pi-Hsien Wang, "Investigation of Bending Characteristics of Foldable Touch Display Panel with a Protection Structure Design," IMPACT2014 , 2014-10. 台北南港世貿.
5 方俊、夏育群、鄭仙志及廖崇鈞, "混合式數值法模擬黏性不可壓縮流體流經一圓柱體," 2004航太/民航聯合學術研討會 , 27-39 , 2004-12. 台中,中華民國.
6 Y. C. Shiah、J. Fang、H. C. Cheng, "BEM Analysis of Anisotropic Heat Conduction With Volume Heat Source," 第二十五屆中華民國力學學會年會暨全國力學會議 , CD-ROM , 2001-12. 逢甲大學.
7 H.C. Cheng、Yui-chuin Shiah、Jiunn Fang、Kun-Nan Chen, "A Prototype of a Web-based Distributed Computing and Collaborative Design System," The CAFA Conference of Aviation Safety and Management , CD-ROM , 2001-10. 高雄.

專書論文

專書論文
作者群
論文題目
書名(編輯者)
出版單位
出版日期
卷期別頁數
備註
1 Wen-Hwa Chen, Hsien-Chie Cheng Molecular Modeling and Simulation of Physical Properties and Behavior of Low-Dimensional Carbon Allotropes Trends in Nanoscale Mechanics (Vasyl Harik ) Springer 2014-08-01 226頁 NSC100-2221-E-035-036-MY3, NSC101-2221-E-007-009-MY3
2 黃錦煌,鄭仙志等 產學合作系列-矽品精密工業股份有限公司 矽統先驅、品質認證-積體電路封裝測試導領者 逢甲大學產學合作案例選粹-黃錦煌主編 逢甲大學出版社 2011-08-01 28-82 逢甲大學 (ISBN 978-986-7621-87-5)

核准專利

核准專利
專利名稱
類別
文號
日期(起)
日期(迄)
1 發光二極體散熱結構 發明 I607176 2017-12 2034-08
2 記憶體電容的電極結構及其製造方法 發明 I482209 2015-04 2028-03
3 Stacked Capacitor Structure and Manufacturing Method Thereof 發明 8,134,823 B2 2012-03 2032-03
4 堆疊式電容器架構及其製造方法 發明 I357132 2012-01 2032-01
5 Electrode Structure of Memory Capacitor and Manufacturing Method Thereof 發明 7,999,350 2011-08 2031-08
6 存儲器電容的電極結構以及存儲器電容結構的製造方法 發明 ZL2008 1 0085490.4 2011-07 2031-07
7 Electrode Structure of Memory Capacitor and Manufacturing Method Thereof 發明 2010-08 2011-07
8 Composite bump 發明 7,378,746 2008-05 2028-05
9 Composite bump 發明 7,378,746 2008-05 2028-05
10 Three-dimensional Multichip Stack Electronic Package Structure 發明 7,211,886 2007-08 2027-07
11 超微間距電子構裝凸塊結構 發明 2007-02 2026-07
12 晶片封裝體及其可形變之複合凸塊結構(Electronic Packaging and Its Deformable Composite Bump Structure) 發明 I269421 2006-12 2025-12
13 多晶片堆疊立體電子構裝結構 發明 I234859 2005-06 2020-06
14 具基板側凸塊結構之電子構裝結構 發明 I225381 2004-12 2023-12

科技部計畫

科技部計畫
計畫名稱
計畫日期(起)
計畫日期(迄)
計畫編號
擔任工作
1 先進單/多晶片扇出型晶圓層級構裝製程良率關鍵力學因子研究(3/3) 2020-08 2021-07 MOST107-2221-E-035-022-MY3 主持人
2 寬頻隙高頻SiC MOSFET 功率半導體為基三相T型三階逆變器封裝的磁電熱機械耦合行為評估(1/3) 2020-08 2021-07 MOST109-2221-E-035-004-MY3 主持人
3 先進單/多晶片扇出型晶圓層級構裝製程良率關鍵力學因子研究(2/3) 2019-08 2020-07 MOST107-2221-E-035-022-MY3 主持人
4 先進馬達變頻驅動器電力電子封裝元件/模組的 電性、熱傳以及機械耦合分析與設計(3/3) 2019-08 2020-07 MOST106-2221-E-035-052-MY3 主持人
5 先進單/多晶片扇出型晶圓層級構裝製程良率關鍵力學因子研究(1/3) 2018-08 2019-07 MOST107-2221-E-035-022-MY3 主持人
6 先進馬達變頻驅動器電力電子封裝元件/模組的 電性、熱傳以及機械耦合分析與設計(2/3) 2018-08 2019-07 MOST106-2221-E-035-052-MY3 主持人
7 高微凸塊接點可靠度及散熱效能3D IC構裝技術開發(3/3) 2013-08 2014-07 NSC100-2221-E-035-036-MY3 主持人
8 高微凸塊接點可靠度及散熱效能3D IC構裝技術開發(2/3) 2012-08 2013-07 NSC100-2221-E-035-036-MY3 主持人
9 ACF型態超薄覆晶軟膜構裝可靠度、可撓性及吸濕特性分析與設計(2/2) 2012-08 2013-07 NSC100-2221-E-035-047-MY2 主持人
10 高微凸塊接點可靠度及散熱效能3D IC構裝技術開發(1/3) 2011-08 2012-07 NSC100-2221-E-035-036-MY3 主持人
11 ACF型態超薄覆晶軟膜構裝可靠度、可撓性及吸濕特性分析與設計(1/2) 2011-08 2012-07 NSC100-2221-E-035-047-MY2 主持人
12 創新先進之矽通孔型態三維晶片堆疊構裝技術的設計、分析與製造 2010-08 2011-07 NSC99-2221-E-035-021- 主持人
13 以奈米碳管束為凸塊之超細微間距覆晶構裝技術之設計、分析與開發 2009-08 2010-07 NSC98-2221-E-035-024- 主持人
14 下世代先進超細微接腳覆晶構裝技術之設計、分析與製造(3/3) 2008-08 2009-07 NSC95-2221-E-035-018-MY3 主持人

獎勵及指導學生獲獎

獎勵及指導學生獲獎
年度
獲獎名稱
授獎單位
獲獎日期
備註
1 107 Best Associate Editor Award IEEE Electronics Packaging Society 2019-05-28
2 107 Best Student Paper Award 2018 International Microsystems, Packaging, Assembly and Circuits Technology (IM 2018-10-25
3 107 107年度科技部獎勵特殊優秀人才 科技部 2018-09-10
4 107 Best Paper Award IEEE 38th International Electronics Manufacturing Technology Conference 2018-09-06 含學生
5 106 106年度科技部獎勵特殊優秀人才 科技部 2017-09-10
6 105 105年度科技部獎勵特殊優秀人才 科技部 2016-09-10
7 104 104年度科技部獎勵特殊優秀人才 科技部 2015-09-10
8 103 103年度科技部獎勵特殊優秀人才 科技部 2014-09-10
9 102 Best Student Paper Award(Gold) IMPACT2013 2013-10-22
10 102 102年度科技部獎勵特殊優秀人才 科技部 2013-09-10
11 101 101年度科技部獎勵特殊優秀人才 科技部 2012-09-10
12 100 功在學會獎牌 IMAPS Taiwan 學會 2012-03-05 本人
13 100 Best Student Paper Award IMPACT2011 2011-10-21
14 100 100年度科技部獎勵特殊優秀人才 科技部 2011-09-10
15 98 ADAMS課程教學滿意度全校前10% 逢甲大學教務處 2010-11-08
16 99 Best Student Paper Award IMPACT2010 2010-10-22
17 99 99年度科技部獎勵特殊優秀人才 科技部 2010-09-10
18 98 課程學習歷程檔案協作優良教師 逢甲大學圖書館 2010-03-25 指導學生參與
19 98 ProE 課程教學滿意度全校前10% 逢甲大學教務處 2010-03-12
20 98 Best Student Paper Award IMPACT2009 2009-10-23
21 95 95學年度研發成果傑出獎 逢甲大學 2006-11-01
22 94 94學年度計劃績優獎 逢甲大學 2005-11-01
23 92 第二十七屆全國力學會議學生論文競賽固力組佳作 第二十七屆全國力學會議 2003-08-01 (與陳文華教授共同指導)
24 91 第二十六屆全國力學會議學生論文競賽熱流組第一名 全國力學會議 2002-08-01 (與陳文華教授共同指導)
25 89 最佳論文發表獎 MSC.Software Taiwan Solution Forum 2000 2000-10-16 本人
26 88 中華民國力學期刊論文獎第三名 中華民國力學學會 1999-12-17 本人
27 88 88年度甲等研究獎 國科會 1999-08-01 本人
28 87 88年度甲等研究獎 國科會 1998-08-01 本人

產學合作計畫

產學合作計畫
計畫名稱
計畫日期(起)
計畫日期(迄)
擔任工作
1 FCCSP製程翹曲預測及不確定分析 2020-05 2020-08 主持人
2 FCCSP翹曲研究 2019-02 2019-05 主持人
3 HBW構裝製程翹曲研究 2018-03 2018-10 主持人
4 可拉伸電子電路金屬導線界面黏著強度分析與結構幾何最佳化設計計畫 2018-01 2018-12 主持人
5 可伸縮電子電路金屬導線力學分析與設計 2017-08 2017-12 主持人
6 FOWLP構裝製程翹曲研究 2016-11 2017-09 主持人
7 卷對卷凹版轉印金屬電極於超薄玻璃基板之製程力學與彎曲疲勞分析 2015-12 2016-12 主持人
8 功率模組模擬分析研究專案之熱傳應力模擬分析 2015-07 2015-12 主持人
9 卷軸式細導線凹版轉印製程熱機械分析 2014-12 2015-12 主持人
10 FPC軟板熱應力機制研究 2014-11 2014-12 主持人
11 Glass Interposer 計畫熱機械力學與破裂行為模擬 2014-04 2014-06 主持人
12 摺疊式觸控面板的保護機構應力分析 2014-03 2014-12 主持人
13 TSV等效熱膨脹係數計算技術開發 2013-01 2013-12 主持人
14 功率模組之可靠度分析 2012-08 2012-12 主持人
15 先進超薄晶片堆疊技術熱傳及應力有限元素分析技術服務 2012-03 2012-12 主持人
16 構裝層級/板層級/系統層級FCBGA元件錫球疲勞壽命分析與關聯性研究 2008-07 2009-06 主持人